Title

Effect of substrate temperature on the interface bond between support and substrate during selective laser melting of Al-Ni-Y-Co-La metallic glass

Document Type

Journal Article

Publisher

Elsevier

Faculty

Health, Engineering and Science

School

School of Engineering

Comments

This article was originally published as: Li, X. P., Roberts, M., Liu, Y. J., Kang, C. W., Huang, H., & Sercombe, T. B. (2015). Effect of substrate temperature on the interface bond between support and substrate during selective laser melting of Al–Ni–Y–Co–La metallic glass. Materials & Design, 65, 1-6. Original article available here

Abstract

An Al-Ni-Y-Co-La metallic glass was laser-melted onto an Al substrate which was at two different temperatures: 25. °C and 250. °C. It was found that the substrate temperature played a critical role in determining the interface bonding between substrate and support and final solidification microstructures. The higher substrate temperature resulted in the formation of a stronger interface bond between metallic glass and substrate while lower substrate temperature resulted in the formation of a weaker interface bond. This has been attributed to different cooling rates and thermal histories present in the two cases. A multi-physics-based computational model based on the heat transfer theory in heat transient mode of COMSOL™ was introduced to explain the underlying mechanism.

DOI

10.1016/j.matdes.2014.08.065

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