Date of Award

1-1-2005

Degree Type

Thesis

Degree Name

Master of Engineering Science

School

School of Engineering and Mathematics

Faculty

Faculty of Computing, Health and Science

First Advisor

Prof. Kamran Eshraghian

Second Advisor

Prof. Mike Myung-Ok Lee

Third Advisor

Prof. Byung-Lok Cho

Abstract

At present, as we enter the nano and giga-scaled integrated-circuit era, there are many system design challenges which must be overcome to resolve problems in current systems. The incredibly increased nonrecurring engineering (NRE) cost, abruptly shortened Time-to- Market (ITA) period and ever widening design productive gaps are good examples illustrating the problems in current systems. To cope with these problems, the concept of an Adaptive Computing System is becoming a critical technology for next generation computing systems. The other big problem is an explosion in the interconnection wire requirements in standard planar technology resulting from the very high data-bandwidth requirements demanded for real-time communications and multimedia signal processing. The concept of 3D-vertical integration of 2D planar chips becomes an attractive solution to combat the ever increasing interconnect wire requirements. As a result, this research proposes the concept of a novel 3D integrated adaptive computing system, which we term 3D-ACSoC. The architecture and advanced system design methodology of the proposed 3D-SoftChip as a forthcoming giga-scaled integrated circuit computing system has been introduced, along with high-level system modeling and functional verification in the early design stage using SystemC.

Included in

Engineering Commons

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