Document Type

Journal Article

Publication Title

Designs

Volume

6

Issue

3

Publisher

MDPI

School

School of Engineering

RAS ID

44373

Comments

Nawaz, A., Ahmad, I., Akram, W., Islam, B., Pimenov, D. Y., Giasin, K., & Aamir, M. (2022). One factor at a time analysis to modify potting technique for manufacturing of bubble-free high-voltage polyester insulated automotive coils. Designs, 6(3). https://doi.org/10.3390/designs6030044

Abstract

The current study focuses on minimising the bubbles in polyester-insulated ignition coils, which were produced with a defect level of ~21–25% or 210–250 coils per 1000 batch size by using the potting method. This high-level rejection makes a substantial financial impact by increasing waste material, manufacturing, and after-sales costs. Hence, to control the bubbled problem without using expensive and maintenance-heavy techniques, the process parameters in the potting method were alternated and investigated using one factor at a time, which played a vital role in the formation/ reduction of bubbles in the ignition coil insulation. Process parameters, including pre/process heating, the appropriate MEKP/cobalt naphthenate ratio, the pouring amount/increments, and the stirring speeds, reduced the bubble formation per lot from 205 ± 30 to 146 ± 25, 108 ± 21, 61 ± 17, and 10 ± 2 per 1000 lot accordingly. In addition, a comparative study was conducted in terms of performance and life cycle endurance, using Japanese and Indian standards. Furthermore, an after-sale warranty claim also supports the proposed changes in the potting technique. This modification may reduce the after-sales rejection within two years to approximately ~85%. This modification in the potting technique is extremely cost-effective in comparison to expensive processes, i.e., vacuum-pressure impregnation and vacuum impregnation, which require extensive labour and maintenance.

DOI

10.3390/designs6030044

Creative Commons License

Creative Commons Attribution 4.0 License
This work is licensed under a Creative Commons Attribution 4.0 License.

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