Simulation vs. measurement of polyaniline for electromagnetic interference shielding

Document Type

Conference Proceeding

Publisher

IEEE

Faculty

Faculty of Health, Engineering and Science

School

School of Engineering

RAS ID

19193

Comments

Al-Shabib W. (2014). Simulation vs. measurement of polyaniline for electromagnetic interference shielding. 2014 World Congress on Computer Applications and Information Systems, WCCAIS 2014. (pp.1 -4). Hammamet, Tunisia. IEEE. © 2014 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. Available here

Abstract

In this paper it is shown that the data obtained from an open air shielding experiment for Polyaniline (Pani) can be simulated using COMSOL4.3b, and the results of the simulation correlate with the experimental results. Pani belongs to the family of Intrinsic Conducting Polymer (ICP), by comparing the results between the transmission loss data (S21) that was obtained experimentally with the simulated results; it is possible then to predict the transmission loss (S21) of the ICP materials and benefits from its use in electromagnetic shielding. The benefits of using ICP are shown in terms of the range of transmission loss that cover compared to the current carbon and metal based materials are demonstrated. The experimental results are shown that the transmission loss (S21) of the ICP materials varies and depends on its conductivity, permittivity, and permeability. This article establishes that Electromagnetic Radiation (EMR) measurement simulated by COMSOL 4.3b provides valid results. This simulated model has advantages in EMC design with better cost effectives design that include less Electromagnetic (EM) reflection, that will help to improve the functionality of any device that is based on ICP materials.

DOI

10.1109/WCCAIS.2014.6916597

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