3D-SoftChip: A novel 3D vertically integrated adaptive computing system

Authors

Chul Kim, Edith Cowan University
Alex Rassau, Edith Cowan UniversityFollow
Stefan Lachowicz, Edith Cowan UniversityFollow
Saeid Nooshabadi
Kamran Eshraghian, Edith Cowan University

Document Type

Conference Proceeding

Publisher

Springer

Faculty

Faculty of Computing, Health and Science

School

School of Engineering and Mathematics

RAS ID

3562

Comments

Kim, C., Rassau, A., Lachowicz, S., Nooshabadi, S., & Eshraghian, K. (2005, February). 3D-SoftChip: A novel 3D vertically integrated adaptive computing system. In 2005 Thirteenth ACM International Symposium on Field Programmable Gate Arrays (p. 71-86). Available here

Abstract

This paper introduces a novel 3-Dimensional (3D) vertically integrated adaptive computing system. This 3D-SoftChip is a combination of state-of-the-art processing and interconnection technology. It comprises the vertical integration of two chips (a Configurable Array Processor and an Intelligent Configurable Switch) through indium bump 3D interconnections. The Configurable Array Processor (CAP) is an array of heterogeneous processing elements (PEs) while the Intelligent Configurable Switch (ICS) comprises a switch block, 32-bit dedicated RISC processor for control, on-chip program/data memory, data frame buffer along with a Direct Memory Access (DMA) controller. This paper introduces the 3D-Softchip architecture for real-time communication and multimedia signal processing as a next generation computing system and describes the HW/SW codesign and verification methodology using SystemC.

Access Rights

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