Grain coarsening behavior in a nanocrystalline copper subjected to sliding friction

Authors

Y S. Zhang
Hong-zhi Niu
Laichang Zhang, Edith Cowan UniversityFollow
X F. Bai
X M. Zhang
P X. Zhang

Document Type

Journal Article

Publisher

Elsevier

Faculty

Faculty of Health, Engineering and Science

School

School of Engineering

RAS ID

17704

Comments

Zhang Y.S., Niu H.Z., Zhang L.C., Bai X.F., Zhang X.M., Zhang P.X. (2014). Grain coarsening behavior in a nanocrystalline copper subjected to sliding friction. Materials Letters, 123, 261-264. Available here

Abstract

A grain coarsening behavior was reported in this work in nanocrystalline copper during sliding friction. The cross-sectional microstructure and micro-hardness of the pure copper subjected to sliding friction were investigated in detail. A nano-grained surface layer of copper was obtained after sliding against a WC-Co ball for the first 100 cycles. However, a pronounced grain coarsening was observed during the subsequent sliding cycles. Such a behavior is dominated by high stress, high strain as well as large amplitude adopted in sliding friction.

DOI

10.1016/j.matlet.2014.02.050

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